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AR

  • Tracking Built-in Camera
  • Built-in Sensors (IMU)
  • RF Signal
  • Internal Connection (USB/HDMI)
  • Liquid Crystal Display
  • Battery
  • Speakers / Headphones / Earphones
Tracking Built-in Camera
NOVASTACK® 35-HDH
1.5 mm height, 0.35 mm pitch , Fully-shielded and high-profile design, High-speed 40 Gbps(≒20 GHz)/lane transmission
  • BOARD TO BOARD
CABLINE®-UY
Low mating height (Height = 0.82 mm Max.), Suitable for high-data-rate transfer (32 Gbps/lane), Narrow pitch (0.35 mm pitch), Right angle vertical mating type micro-coaxial cable connector
  • MICRO-COAXIAL
  • FPC
MINIFLEX® 3-BFN
Low profile (Height = 0.9 mm), 0.3 mm pitch, horizontal mating, backflip
  • FPC
MINIFLEX® 3-BFNH
Improved retention force, footprint compatibility, 0.3 mm pitch, horizontal
  • FPC
NOVASTACK® 35-HDP
High-speed (20+ Gbps/lane) fully-shielded with power contacts, 0.35 mm pitch, 0.7 mm height
  • BOARD TO BOARD
  • POWER PIN
  • EMI SHIELD
DW-5
Hybrid connector for discrete wire and FPC, height = 1.0 mm, 0.5 mm pitch, horizontal, backflip
  • FPC
  • DISCRETE WIRE
Built-in Sensors (IMU)
NOVASTACK® 35-HDH
1.5 mm height, 0.35 mm pitch , Fully-shielded and high-profile design, High-speed 40 Gbps(≒20 GHz)/lane transmission
  • BOARD TO BOARD
CABLINE®-UY
Low mating height (Height = 0.82 mm Max.), Suitable for high-data-rate transfer (32 Gbps/lane), Narrow pitch (0.35 mm pitch), Right angle vertical mating type micro-coaxial cable connector
  • MICRO-COAXIAL
  • FPC
MINIFLEX® 3-BFN
Low profile (Height = 0.9 mm), 0.3 mm pitch, horizontal mating, backflip
  • FPC
MINIFLEX® 3-BFNH
Improved retention force, footprint compatibility, 0.3 mm pitch, horizontal
  • FPC
NOVASTACK® 35-HDP
High-speed (20+ Gbps/lane) fully-shielded with power contacts, 0.35 mm pitch, 0.7 mm height
  • BOARD TO BOARD
  • POWER PIN
  • EMI SHIELD
DW-5
Hybrid connector for discrete wire and FPC, height = 1.0 mm, 0.5 mm pitch, horizontal, backflip
  • FPC
  • DISCRETE WIRE
RF Signal
CABLINE®-UY
Low mating height (Height = 0.82 mm Max.), Suitable for high-data-rate transfer (32 Gbps/lane), Narrow pitch (0.35 mm pitch), Right angle vertical mating type micro-coaxial cable connector
  • MICRO-COAXIAL
  • FPC
MHF® 7S
Excellent EMC performance with fully-shielded design, ideal for 5G mmWave applications, VSWR 1.5 max at 15 GHz in small 2.0 x 2.0 mm footprint
  • EMI SHIELD
  • MICRO-COAXIAL
NOVASTACK® 35-HDN
Fully-shielded and narrow design, Good performance at high frequency and high speed signals. Power supply is available with Corson Alloy contact, 0.35 mm pitch, 0.7mm height
  • BOARD TO BOARD
  • EMI SHIELD
MHF® 4
Low-profile design (mated height : 1.2 mm max.), ideal for use in limited spaces
  • MICRO-COAXIAL
MHF® 5
Low-profile (mated height = 1.0 mm max.), supports to 12 GHz
  • MICRO-COAXIAL
MHF® I LK
Locking solution that works with MHF I receptacles, supports up to 9 GHz, mated height of 2.9 mm max
  • MICRO-COAXIAL
MHF® 4L LK
Locking solution that works with MHF® 4/4L receptacles, mated height of 2.0 mm max., excellent electrical performance up to 12 GHz
  • MICRO-COAXIAL
Internal Connection (USB/HDMI)
EVAFLEX® 5-HD
Fully-shielded, high-speed, auto-locking, horizontal mate, 0.5 mm pitch shielded FFC/FPC connector
  • FFC
  • FPC
  • EMI SHIELD
  • SHIELD FFC
CABLINE®-UX II
Slim design suitable for through-hole solution,　narrow pitch (0.25 mm), Right angle vertical mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-CX II With Cover
Narrow pitch (0.25 mm pitch), Low mating height (Height = 1.00 mm max.), EMI shielding cover and multi-point ground with mechanical lock, Horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-CX II Without Cover
Narrow pitch (0.25 mm pitch), Low mating height (Height = 0.78 mm max), Mechanical lock with shielding and multi-point ground, Horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-UM
Fully-shielded and multi-point ground, Mechanical lock, High-data-rate transfer (40 Gbps/lane PAM3), 0.4 mm pitch, Right angle vertical mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
Liquid Crystal Display
MINIFLEX® 4-ST
Super low profile (height = 0.5 mm), 0.4 mm pitch, horizontal mating, backflip
  • FPC
NOVASTACK® 35-HDP
High-speed (20+ Gbps/lane) fully-shielded with power contacts, 0.35 mm pitch, 0.7 mm height
  • BOARD TO BOARD
  • POWER PIN
  • EMI SHIELD
CABLINE®-CA IIF
Fully-shielded with mechanical lock, suitable for high-data-rate transfer (32 Gbps/lane),0.4 mm pitch, Horizontal mating type FPC plug connector
  • FPC
CABLINE®-CA II
Fully-shielded with mechanical lock, suitable for high-data-rate transfer (32 Gbps/lane), 0.4 mm pitch, horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-CA
High-data-rate transfer (32 Gbps/Lane), mechanical lock with shielding and multi-point ground, 0.4 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-CX II With Cover
Narrow pitch (0.25 mm pitch), Low mating height (Height = 1.00 mm max.), EMI shielding cover and multi-point ground with mechanical lock, Horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-CX II Without Cover
Narrow pitch (0.25 mm pitch), Low mating height (Height = 0.78 mm max), Mechanical lock with shielding and multi-point ground, Horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-UM
Fully-shielded and multi-point ground, Mechanical lock, High-data-rate transfer (40 Gbps/lane PAM3), 0.4 mm pitch, Right angle vertical mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
Battery
NOVASTACK®-B
Supports high power delivery, robust design, 0.4 mm pitch, 0.6 mm height, 2.6 mm depth
  • BOARD TO BOARD
  • POWER PIN
Speakers / Headphones / Earphones
CABLINE®-UY
Low mating height (Height = 0.82 mm Max.), Suitable for high-data-rate transfer (32 Gbps/lane), Narrow pitch (0.35 mm pitch), Right angle vertical mating type micro-coaxial cable connector
  • MICRO-COAXIAL
  • FPC
MHF® 4L LK
Locking solution that works with MHF® 4/4L receptacles, mated height of 2.0 mm max., excellent electrical performance up to 12 GHz
  • MICRO-COAXIAL
MHF® 4
Low-profile design (mated height : 1.2 mm max.), ideal for use in limited spaces
  • MICRO-COAXIAL
NOVASTACK® 35-P
Robust connector with hold-down feature and Corson Alloy main contacts to transmit power, 0.35 mm pitch, 0.7 mm height, 2.3 mm depth
  • BOARD TO BOARD
  • POWER PIN
NOVASTACK®-B
Supports high power delivery, robust design, 0.4 mm pitch, 0.6 mm height, 2.6 mm depth
  • BOARD TO BOARD
  • POWER PIN
MINIFLEX® 3-BFT
0.3 mm pitch, Horizontal mating, Backflip, Super low profile, (height = 0.65 mm)
  • FPC
DW-5
Hybrid connector for discrete wire and FPC, height = 1.0 mm, 0.5 mm pitch, horizontal, backflip
  • FPC
  • DISCRETE WIRE

Related Topics

MHF® LK Series / Micro RF Coaxial Connector with locking function

Locking solution that works with Micro RF connector, MHF
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CABLINE®-UM / Micro-Coaxial Wire-to-Board Connector

0.4 mm pitch, right angle vertical mating type, micro-coaxial cable connector with EMI shielding design (optional mechanical lock)
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NOVASTACK® 35-HDN / 5G Connector : Shielded Board to Board Connector

Ideal for 5G mmWave antenna module and devices, fully-shielded and narrow design, Power supply is available with Corson Alloy contact, 0.35 mm pitch, 0.7 mm height
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Micro-Coaxial Cable Assembly Capabilities

Featuring mechanical and signal transmission benefits and advantages of Micro-Coaxial Cable Assemblies. These assemblies are capable of handling high data rates, while providing high degree of flexibility and high shielding performance.
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WEBINAR: Fully-Shielded Connectors for Next-Gen Displays

Learn more about our high-speed, fully-shielded connectors for displays.
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Common design concept for connectors

The I-PEX connector product lineup includes a series of connectors that employ a common design concept with multiple connection options. For PCB module products that are versatile for a variety of electronic devices, adopting a connector with a common design concept allows for the selection of multiple connection methods. As the number of PCB module connection method options increases, the markets for devices that can be targeted will also expand.　I-PEX proposes to use the common design connectors with wide range of connection method options, especially when developing highly versatile modules.
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I-PEX ZenShield® connectors are recommended for signal transmission from camera module using MIPI

Notebook PCs and tablets, which are densely populated with various electronic components, antennas are often mounted nearby, and MIPI signals may adversely affect the antennas. Therefore, EMC measures are very effective to prevent signal interference between them. The I-PEX ZenShield® connector series can provide excellent EMC countermeasures.
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Hinge Component Pass-Through with CABLINE® Harness Assemblies

In recent years, device makers are paying much more attention to slimmer designs,  which requires more innovative ideas to fit components in these much smaller spaces. The CABLINE® series harness assemblies are not only capable of transmitting high-speed signals, but they can also be threaded through hinge components in a limited space.
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Design Consideration, Tips & Techniques for 5G Connector Solutions

The deployment of 5G networks, along with their connected devices, will demand more from current connector structures.  This investment in connector technology, for high-volume manufacturing, will have to be balanced between performance, size, and cost to thrive in the market.
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ZenShield®: High-Performance EMC Shielding Connectors

ZenShield® is the brand name for the I-PEX small connector series having high-performance EMC shielding design. ZenShield® gives board designers more flexibility for designing the board by allowing the connectors to be placed in close proximity to sensitive subsystems, such as transmit/receive antennas, that are commonly found in high-performance wireless communication systems.
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How I-PEX Connectors Are Helping to Accelerate the Evolution of AR/VR/MR Devices

The market size of AR/VR/MR is expected to continue to grow significantly in the future, with the strength of improving the sense of immersion in virtual reality. As the pursuit of higher image quality, smaller size, and lighter weight AR/VR/MR devices accelerates, I-PEX contributes to the design of devices with connectors that are both smaller and transmit data faster.
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