Data Centers

  • Motherboard Launch
  • Low Profile Motherboard Launch
  • Riser Card Launch
  • PCB Module
  • Extender Cable
  • Backplane
  • External Optical Module
  • Internal Optical Module
Motherboard Launch
CABLINE®-VS II
Fully-shielded with mechanical lock, Suitable for high-data-rate transfer (20 Gbps/lane), 0.5 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
Low Profile Motherboard Launch
CABLINE®-VS II
Fully-shielded with mechanical lock, Suitable for high-data-rate transfer (20 Gbps/lane), 0.5 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
Riser Card Launch
CABLINE®-CA II
Fully-shielded with mechanical lock, High-data-rate transfer (20 Gbps/lane), 0.4 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
CABLINE®-VS II
Fully-shielded with mechanical lock, Suitable for high-data-rate transfer (20 Gbps/lane), 0.5 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
CABLINE®-UM
Fully-shielded and multi-point ground, Mechanical lock, High-data-rate transfer (20 Gbps/lane), 0.4 mm pitch, Right angle vertical mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
PCB Module
CABLINE®-CA II
Fully-shielded with mechanical lock, High-data-rate transfer (20 Gbps/lane), 0.4 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
CABLINE®-VS II
Fully-shielded with mechanical lock, Suitable for high-data-rate transfer (20 Gbps/lane), 0.5 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
CABLINE®-UM
Fully-shielded and multi-point ground, Mechanical lock, High-data-rate transfer (20 Gbps/lane), 0.4 mm pitch, Right angle vertical mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
Extender Cable
CABLINE®-CA II
Fully-shielded with mechanical lock, High-data-rate transfer (20 Gbps/lane), 0.4 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
CABLINE®-VS II
Fully-shielded with mechanical lock, Suitable for high-data-rate transfer (20 Gbps/lane), 0.5 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
CABLINE®-UM
Fully-shielded and multi-point ground, Mechanical lock, High-data-rate transfer (20 Gbps/lane), 0.4 mm pitch, Right angle vertical mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
Backplane
CABLINE®-CA II
Fully-shielded with mechanical lock, High-data-rate transfer (20 Gbps/lane), 0.4 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
CABLINE®-VS II
Fully-shielded with mechanical lock, Suitable for high-data-rate transfer (20 Gbps/lane), 0.5 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
CABLINE®-UM
Fully-shielded and multi-point ground, Mechanical lock, High-data-rate transfer (20 Gbps/lane), 0.4 mm pitch, Right angle vertical mating type micro-coaxial connector
  • MICRO-COAX
  • DISCRETE WIRE
External Optical Module
NOVASTACK® 35-HDP
High-speed (20+ Gbps/lane) fully-shielded with power contacts, 0.35 mm pitch, 0.7 mm height
  • BOARD TO BOARD
  • POWER PIN
  • EMI SHIELD
Internal Optical Module
LIGHTPASS™-EOB 100G
100 G（25 Gbps x 4 ch） Bi-directional, Low profile, MPU integrated, Low power consumption, photoelectric conversion module
LIGHTPASS™-EOM 100G
100Gbps（25Gbps x 4ch） Bi-directional, High Density, Low power, mid-board optical module

Related Topics

Enterprise Solutions for 112 Gbps PAM4 Applications

Check out I-PEX Enterprise Solutions for 112 Gbps PAM4 Applications. LEAPWIRE™ (Twinax Cable), DUALINE™ 195-HB, DUALINE™ 110-VB-M, and Board-to-Board (Optics or other mezzanine applications) are introduced in this video.
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Server Design / Solutions for Enterprise Computing

I-PEX connectors solutions for enterprise computing applications.
Server-Solution

I-PEX Enterprise Solutions for 112 Gbps PAM4 (2022/Mar/18)

In recent years, infrastructure telecommunication, such as servers and switches, have become increasingly faster in the enterprise market. The challenge is that conventional PCB trace transmission have large insertion losses with limited transmission distance.  A co-package system also faces the challenge of high-density packaging. I-PEX has begun development of our new LEAPWIRE™/DUALINE™ series 112 Gbps PAM4 using high-speed Twinax Cables and 112Gbps PAM4 board-to-board connection to solve these problems.
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Development of Paddle-Card Solutions for 56Gbps PAM4 / PCIe Gen6 PAM4 (2021/Sep/14)

Enterprise computing applications that require high-speed transmission, such as servers, switches, storage, etc., require higher electrical characteristics performance for loss and crosstalk that affect signal waveform deterioration. I-PEX has established technologies and production systems that can support high-speed transmission such as 56 Gbps PAM4 and PCIe Gen6 64 GT/s PAM4 used in enterprise computing applications, by combining existing micro-coaxial connectors with paddle-card solutions.
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Ultra-Small Active Optical Module : LIGHTPASS™ Series

The LIGHTPASS™ Series makes it possible to shorten the copper trace length on the system board by placing the electrical-to-optical (E-to-O) conversion closer to the processor, reducing electrical transmission losses.
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Transmission Comparison between Micro-coaxial Harness Jumper and Low-transmission-loss Board Connections

Looking for a countermeasure to extend a required transmission distance while suppressing loss? Our micro-coaxial harness jumper can transmit about two to three times longer than if using a low-transmission-loss board at any speed.
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I-PEX Connectors and Mellanox Collaboration (2019/Mar/18)

I-PEX Connectors Selected by Mellanox Technologies as Provider for Low-Profile Cable Assembly Connectors 

Mellanox Controller

Low-Speed Cable Assemblies in Enterprise Applications

As data rates increase, servers are using more cable assemblies. High-speed cables are the main driver, as PCBs can no longer “go the distance.” But low-speed cable assemblies continue to be important. Low-speed assemblies are still commonly used for power distribution, low-speed signals and auxiliary lines.
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Server Design Is Getting Complicated

Like never before, today’s computing environment requires an increasing complexity of enterprise-level equipment. As data rates rise, complexity issues are exacerbated by the performance limits being encountered in standard-build materials. Faster data rates require faster rise times, which incur more loss in high-speed signals. While higher performance laminate materials can be used to compensate, the results may not be enough and can involve a significant cost.
Server Design Chassis

ZenShield®: High-Performance EMC Shielding Connectors

ZenShield® is the brand name for the I-PEX small connector series having high-performance EMC shielding design. ZenShield® gives board designers more flexibility for designing the board by allowing the connectors to be placed in close proximity to sensitive subsystems, such as transmit/receive antennas, that are commonly found in high-performance wireless communication systems.
ZenShield