CABLINE^®-CAL IIF

フルシールド＆メカニカルロック付き、高速伝送対応(32 Gbps/lane)、0.4 mmピッチ、水平嵌合タイプFPCコネクタ

低背(高さ = 0.9 mm max.)、ZenShield^®フルシールドと多点グランド構造で、EMCソリューションに最適

※コネクタの取り扱いについては「挿抜方法」の動画をご参照ください。

Contact Pitch:

0.4 mm

Mating Type / Direction:

Horizontal

Mated Height:

Nom. 0.74 +/- 0.16 mm

Operating Temperature:

-40 to 85℃ (233 to 358 K)

FPC / FFC Thickness:

Contact Area: 0.25 +0.02/-0.03 mm, Ground Area: 0.37 +0.04/-0.06 mm

Current Rating:

0.2 A0.26 A

Measurement results

Connector : CABLINE-CAL IIF 50P
FPC : Shielded FPC, Differential 90 ohm
Length : 100 mm
Pin Assignment : GSSGSSG

干渉プラグがレセプタクルに正常に嵌合されている場合にのみロックが可能

Transmission Speed (Reference Only)	32 Gbps/lane NRZ
Contact Pitch	0.4 mm
Mating Type / Direction	Horizontal
Mated Height	Nom. 0.74 +/- 0.16 mm
Available Pin Count	Signal: 50
Depth	6.41 mm
Width	5.74 + (0.4 x pin count) mm
Operating Temperature	-40 to 85℃ (233 to 358 K)
FPC / FFC Thickness	Contact Area: 0.25 +0.02/-0.03 mm, Ground Area: 0.37 +0.04/-0.06 mm
FPC Type	Shielded FPC
Current Rating	0.2 A0.26 A
Applicable Standards (Reference Only)	32 Gbps/LaneUSB4 Gen 4 (40 Gbps/Lane PAM3)Thunderbolt 5 (40 Gbps/Lane PAM3)USB4 Gen 3 (20 Gbps/Lane)DisplayPort UHBR20 (20 Gbps/Lane)V-By-One US (16 Gbps/Lane)HDMI 2.1 (12 Gbps/Lane)USB 3.2 Gen 2 (10 Gbps/Lane)DisplayPort UHBR3 (8.1 Gbps/Lane)HDMI 2.0 (6 Gbps/Lane)eDP HBR 2 (5.4 Gbps/Lane)USB 3.1 Gen 1 (5 Gbps/Lane)V-By-One HS 1.4 (4 Gbps/Lane)HDMI 1.3 (3.4 Gbps/Lane)eDP (2.7 Gbps/Lane)MiPi standards
Full EMI Shielding (ZenShield®)	Yes
Mechanical lock	Yes