CABLINE^®-CAL IIF

저배(높이 0.9 mm max.), Full Shiel & Mechanical Lock 사양, 고속 데이터 전송(32Gbps/Lane)에 적합, 0.4mm Pitch, 수평 결합형 FPC Connector

저배(높이 0.9 mm max.), ZenShield^® Multi-point Ground를 통한 완전 차폐 Type 구조로 EMC Solution에 이상적입니다

*Connector의 취급 방법은‘삽입 방법’동영상을 참조 부탁 드립니다.

Contact Pitch:

0.4 mm

Mating Type / Direction:

Horizontal

Mated Height:

Nom. 0.74 +/- 0.16 mm

FPC / FFC Thickness:

Contact Area: 0.25 +0.02/-0.03 mm, Ground Area: 0.37 +0.04/-0.06 mm

Current Rating:

0.2 A0.26 A

*SI 테스트 보드 데이터는 2D 도면 아래에 있습니다.

저배(높이 0.9 mm max.),

ZenShield® fully-shielded with multi-point grounds to prevent EMI leakageZenShield® fully-shielded with multi-point grounds to prevent EMI leakage

Measurement results

Connector : CABLINE^®-CAL IIF 50P
FPC : Shielded FPC, Differential 90 ohm
Length : 100 mm
Pin Assignment : GSSGSSG

간섭 Plug가 Receptacle에 정상적으로 결합되어 있을 경우에만 잠금 가능

Transmission Speed (Reference Only)	32 Gbps/lane
Contact Pitch	0.4 mm
Mating Type / Direction	Horizontal
Mated Height	Nom. 0.74 +/- 0.16 mm
Available Pin Count	Signal: 50
Depth	6.41 mm
Width	5.74 + (0.4 x pin count) mm
FPC / FFC Thickness	Contact Area: 0.25 +0.02/-0.03 mm, Ground Area: 0.37 +0.04/-0.06 mm
FPC Type	Shielded FPC
Current Rating	0.2 A0.26 A
Applicable Standards (Reference Only)	32 Gbps/LaneUSB4 Gen 4 (40 Gbps/Lane PAM3)Thunderbolt 5 (40 Gbps/Lane PAM3)USB4 Gen 3 (20 Gbps/Lane)DisplayPort UHBR20 (20 Gbps/Lane)V-By-One US (16 Gbps/Lane)HDMI 2.1 (12 Gbps/Lane)USB 3.2 Gen 2 (10 Gbps/Lane)DisplayPort UHBR3 (8.1 Gbps/Lane)HDMI 2.0 (6 Gbps/Lane)eDP HBR 2 (5.4 Gbps/Lane)USB 3.1 Gen 1 (5 Gbps/Lane)V-By-One HS 1.4 (4 Gbps/Lane)HDMI 1.3 (3.4 Gbps/Lane)eDP (2.7 Gbps/Lane)MiPi standards
Full EMI Shielding (ZenShield®)	Yes
Mechanical lock	Yes