CABLINE^®-CAL IIF

超薄(嵌合高度 0.9 mm max.)，全屏蔽设计和机械锁扣，适用于高速数据传输 (32 Gbps/lane)，0.4mm 间距, 水平对插款的FPC连接器

超薄(嵌合高度 0.9 mm max.)，ZenShield^® 的全屏蔽设计和多点接地结构，EMC 解决方案的理想选择

*操作方法请参考"如何嵌合和拔出"视频。

Contact Pitch:

0.4 mm

Mating Type / Direction:

Horizontal

Mated Height:

Nom. 0.74 +/- 0.16 mm

Operating Temperature:

-40 to 85℃ (233 to 358 K)

FPC / FFC Thickness:

Contact Area: 0.25 +0.02/-0.03 mm, Ground Area: 0.37 +0.04/-0.06 mm

Current Rating:

0.2 A0.26 A

超薄(嵌合高度 0.9 mm max.)

ZenShield® 的全屏蔽设计和多点接地结构，EMC 解决方案的理想选择

Measurement results

Connector : CABLINE^®-CAL IIF 50P
FPC : Shielded FPC, Differential 90 ohm
Length : 100 mm
Pin Assignment : GSSGSSG

无法上锁只有当完全插入后才能上锁

Transmission Speed (Reference Only)	32 Gbps/lane NRZ
Contact Pitch	0.4 mm
Mating Type / Direction	Horizontal
Mated Height	Nom. 0.74 +/- 0.16 mm
Available Pin Count	Signal: 50
Depth	6.41 mm
Width	5.74 + (0.4 x pin count) mm
Operating Temperature	-40 to 85℃ (233 to 358 K)
FPC / FFC Thickness	Contact Area: 0.25 +0.02/-0.03 mm, Ground Area: 0.37 +0.04/-0.06 mm
FPC Type	Shielded FPC
Current Rating	0.2 A0.26 A
Applicable Standards (Reference Only)	32 Gbps/LaneUSB4 Gen 4 (40 Gbps/Lane PAM3)Thunderbolt 5 (40 Gbps/Lane PAM3)USB4 Gen 3 (20 Gbps/Lane)DisplayPort UHBR20 (20 Gbps/Lane)V-By-One US (16 Gbps/Lane)HDMI 2.1 (12 Gbps/Lane)USB 3.2 Gen 2 (10 Gbps/Lane)DisplayPort UHBR3 (8.1 Gbps/Lane)HDMI 2.0 (6 Gbps/Lane)eDP HBR 2 (5.4 Gbps/Lane)USB 3.1 Gen 1 (5 Gbps/Lane)V-By-One HS 1.4 (4 Gbps/Lane)HDMI 1.3 (3.4 Gbps/Lane)eDP (2.7 Gbps/Lane)MiPi standards
Full EMI Shielding (ZenShield®)	Yes
Mechanical lock	Yes