白皮书

Systems incorporating M.2 modules can be affected by electromagnetic noise generated by high-speed signals, potentially impacting EMC performance and overall system reliability. This white paper explores the root causes of electromagnetic interference (EMI) and key mitigation strategies, while presenting simulation and test data that demonstrate the EMI reduction effectiveness of the shielded SX-M2 connector design.
White paper_SX-M2

I-PEX specializes in manufacturing connectors and cable assemblies engineered to maximize signal integrity, minimize electromagnetic interference, and provide high retention force. These characteristics make our solutions well suited for high-speed interfaces such as D-PHY and C-PHY. In this article, we focus on the CABLINE® and NOVASTACK® series, which have been widely adopted for interconnecting D-PHY and C-PHY devices for many years, and introduce their key features.
WhitePaper_what_is_MIPI

本白皮书介绍了 CABLINE® 系列连接器,特别是母座端子为双排排列的CABLINE®-CX II、CABLINE®-UX II 和 CABLINE®-UA II系列连接器。重点讨论了不同的引脚选择和 PCB布线建议,以克服使用双排连接器时面临的一些挑战。
WhitePaper pinout selection and PCB breakout strategies for CABLINE

钢琴盖“空关”是制造和装配现场 FFC/FPC 连接器经常会遇到的现象。 本白皮书以I-PEX的MINIFLEX®系列为例,介绍了什么是连接器“空关”现象,如何解决这个问题,以及通过我们分析和计算得出的设计要点,以确保即使发生“空关”现象,连接器也能正常工作。
WhitePaper thumbnail I-PEX's unique countermeasure to potential issues caused by closing actuator without FPC inserted

电信号传播所经过的介质既可能改善,也可能削弱系统的电磁兼容性。常见的传播介质包括印刷电路板(PCB)走线、互连器件以及电缆。要理解线对内时延偏斜(intrapair skew)如何引发电磁干扰(EMI),首先需要对 EMI 进行明确的定义。
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Paddle card可与其匹配的连接器组合,并且可以根据公座电路设计 PCB 或 FPC。Paddle card易于添加到接地结构中,从而改善接地回路。 阻抗匹配得到简化,信号完整性在较高频率下得到改善。
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Providing EMC Solutions for mmWave and Multi-Gigabit Applications in a Variety of Use Cases
ZenShield White Paper