LIGHTPASS^®是专为板载光学应用设计的一系列多通道超紧凑和超薄型光模块产品。通过启用双向光通信（E-to-O，O-to-E），可以缩短电气传输长度，并显着降低传输损耗。此外，LIGHTPASS^® 产品具有较为宽泛的工作温度适用范围。这个特性可确保在高温环境中（例如高压灭菌器兼容内窥镜摄像头、通信基站、车载摄像头和激光雷达）的稳定性能。

I-PEX offers a wide lineup of connectors with different mating heights to meet various designs and use cases. Our newest board-to-board connectors combine compact size and functionality with a mating height of just 1.5 mm – ideal for space constrained applications.

I-PEX's CABLINE^® micro-coaxial connectors have been successfully designed in many Bozwin CT imaging devices due to their signal transmission and mechanical performance advantages. Our CABLINE^® series connectors are ideal for high-definition imaging and high-speed signal transmission applications.

MHF^®接线夹具，组装I-PEX MHF^®线束，实现高质量、高生产率的配备i-Fit技术的MHF^®接线。

在这份技术报告中，我们将讨论正被越来越多地采用的PAM信号技术的背景和它的定义，以及界定PAM的内容。

I-PEX has launched the AP-10 high-current board to board power terminal connector that supports up to 16 Amp and high heat resistance up to 105℃ degree with a space-saving design that reduces the PCB mounting space.

我们一直推荐并提供将于2030年实现的系统（超越5G系统，无线物联网系统和下一代移动系统）所需的RF连接器。

I-PEX has developed LEAPWIRE^®/DUALINE^® series 112 Gbps PAM4 using high-speed Twinax Cables and MEZZTRACK™ 112Gbps PAM4 board-to-board connection to solve high-density packaging problems.

您是否曾困惑于该如何选择用于高速传输的极细同轴连接器？ --- 有许多因素会使选择连接器变得困难。 ​​​​​​​为了帮助您更容易的做出选择，本文提供了一些示例来说明您应该如何选择最为适合您当下应用的连接器。

I-PEX ZenSheild^® 连接器系列可提供出色的 EMC 应对措施。 360 度 EMC 屏蔽设计不仅可以防止来自公座和母座的接触点的电磁噪声辐射，还可以防止来自信号端子的板安装部分（SMT 位置）的电磁噪声辐射。此外，当连接器嵌合并正确接地到电路板时，公座和母座屏蔽层都正确连接，以便在多个点接地。这确保了连接器金属屏蔽层中产生的电流有足够的接地返回路径。