News & Updates

I-PEX -高频和高速传输领域的连接器领跑者和 Teramount- 硅光子领域的光纤封装领跑者今天宣布,他们正在合作推进应用于数据中心和其他高速数据通信及电信应用的硅光子可拆卸式连接。
In this video LIGHTPASS®-EOB 100G (100 Gbps (25 Gbps x 4 Channels) Bi-directional, Low profile, MPU integrated, Low Power Consumption, Photoelectric Conversion Module) and LIGHTPASS®-EOM 100G (100 Gbps (25 Gbps x 4 Channels ) Bi-directional, High Density, Low Power Consumption, Mid-board Optical Module) are introduced.