CABLINE^®-UMF

풀 실드, 다중 접점 그라운드, 메카니컬 록 포함, 고속 전송 대응(40 Gbps/lane PAM3), 0.4mm 피치, 라이트 앵글의 세로 결합 타입 FPC 커넥터

ZenShield^® Full Shield Multi Point Ground가 있는 EMC Solution에 이상적입니다.

Contact Pitch:

0.4 mm

결합타입:

Vertical (Right Angle)

Mated Height:

2.35 max. mm

Available Pin Count (signal + power):

40 70

Operating Temperature:

- 40 ~ 105 ℃

FPC/FFC Thickness:

0.34 mm

Current rating:

0.3 A/pin

*SI 테스트 보드 데이터는 2D 도면 아래에 있습니다.

Simulation results

Connector:
PLUG: CABLINE^®-UMF
RECEPTACLE: CABLINE^®-UM

Pin Assignment: GSSGSSG

Transmission Speed (Reference Only)	40 Gbps/Lane PAM3
Contact Pitch	0.4 mm
결합타입	Vertical (Right Angle)
Mated Height	2.35 max. mm
Available Pin Count (signal + power)	40 70
Depth	5 mm
Width Formula	With Lock Cover: 2.35 mm max., Without Lock Cover: 2.15 mm max.
Operating Temperature	- 40 ~ 105 ℃
FPC/FFC Thickness	0.34 mm
Shielded FPC	Yes
Shielded FFC	No
Current rating	0.3 A/pin
Applicable Standards (Reference Only)	USB4 Gen4 (40 Gbps/Lane PAM3)Thunderbolt 5 (40 Gbps/Lane PAM3)Thunderbolt 4 (20 Gbps/Lane)USB4 Gen3 (20 Gbps/lane)DisplayPort UHBR20 (20 Gbps/Lane)PCIe 4.0 (16 Gbps/Lane)V-By-One US (16 Gbps/Lane)DisplayPort UHBR13.5 (13.5 Gbps/Lane)HDMI 2.1 (12 Gbps/Lane)DisplayPort UHBR10 (10 Gbps/Lane)eDP HBR 3 (8.1 Gbps)eDP HBR 2 (5.4 Gbps/Lane)USB 3.1 Gen 1 (5 Gbps/Lane)HDMI 2.0 (6 Gbps/Lane)V-By-One HS 1.4 (4 Gbps/Lane)HDMI 1.3 (3.4 Gbps/Lane)eDP (2.7 Gbps/Lane)MiPi standards
Full EMI Shielding (ZenShield®)	Yes
Mechanical lock	Yes

CABLINE-UMF RECOMMENDED PART NUMBERS