I-PEX offers Signal Integrity test boards designed for evaluating the high-frequency transmission characteristics of MHF^® RF connectors and cable assemblies. The SI test boards enable comprehensive signal integrity evaluation of individual connectors as well as complete cable assemblies, including high-frequency RF signal paths on the board.

By using an SI test board, S-parameters can be accurately measured to evaluate connector and cable assembly performance. Key RF performance parameters, including insertion loss, return loss, VSWR, and impedance matching, can therefore be derived from the measured S-parameters.

SI test boards include an MHF^® receptacle mounted on one side of the board, with precision SMA / 2.92 mm RF connectors mounted on the opposite side. The RF connectors are connected to the MHF^® interface through controlled-impedance RF transmission lines to ensure accurate measurement of connector performance. Test board sets are also available for evaluating complete wire assemblies and include calibration boards used to de-embed PCB trace losses for improved measurement accuracy.

These test boards are widely used for performance verification and design evaluation of RF interconnects supporting wireless applications including 5G, Wi-Fi^®, Bluetooth^®, GNSS, cellular, and other high-frequency communication systems.