The AP-TSS10 and AP-LT10 represent a new connection solution that combines high-current capability, high reliability, and exceptional design flexibility. 
Their unique structure, which integrates a spacer and power terminal into a single component, reduces component count, saves PCB space, and lowers assembly workload. In addition, with support for currents up to 32 A and a wide operating temperature range of -40 to +125°C, they are suitable for a broad range of applications including industrial equipment, telecommunications equipment, and power supply systems.

As electronic devices continue to become more sophisticated and higher-performing, PCB designers face growing challenges such as handling high current, securing mounting space, and reducing component count. In industrial equipment, telecommunications systems, and power supply applications in particular, it is essential to transmit high currents safely and efficiently while making effective use of limited PCB space.
At the same time, conventional configurations often result in increased component count, greater assembly effort, and inefficient use of valuable PCB real estate.
 

The I-PEX AP-TSS10and AP-LT10 offer a new connection solution that integrates a spacer and power terminal into a single component. By combining mechanical fastening and electrical connection functions that traditionally required multiple parts, this solution improves efficiency across the design, procurement, and manufacturing processes.
In addition, the reduced PCB footprint enables more efficient use of limited board space, allowing greater flexibility in system design.

The AP-TSS10 utilizes lightweight aluminum material, achieving approximately 67% weight reduction (based on specific gravity comparison) compared to conventional brass components. This helps reduce the load applied to the PCB during both assembly and operation.
Furthermore, it mitigates issues related to concentrated loads and weight distribution in areas where heavier components are mounted, expanding options for component placement and mounting methods. As a result, high-density designs that were previously limited by weight considerations become easier to implement, contributing to greater design flexibility.

The use of aluminum construction enables the AP-TSS10 to support upside-down mounting.
This capability increases flexibility in manufacturing process design, enabling optimized component placement as well as greater freedom in enclosure and thermal management design.
Its compatibility with various connection configurations helps engineers achieve more versatile and flexible PCB designs.