Ruggedized Solution
MINIDOCK™ Series
For applications requiring frequent docking and undocking, the MINIDOCK™ series provides a ruggedized board-to-board solution with durable high-cycle mating performance and reliable connectivity.
The main features of the MINIDOCK™ series are as follows:
- Die-cast shell and large guide pins.
- Guaranteed up to 5,000 mating cycles.
- Guide pins for reliable docking
Plug (above) and Receptacle (below) Mating Combinations
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Mating Type / Direction |
Slim Type |
Standard Type |
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Horizontal |
Horizontal |
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Contact Type |
2 Sequences |
All Long Pins Standard Type |
All Long Pins Offset Type |
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Part Number |
30029 |
30046 |
30001 |
30094 |
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Pin Count |
80 |
160 |
100 |
200 |
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|
Dimensions (WxD) |
36.0 × 14.505 mm |
62.0 × 9.9 mm |
51.65 × 16.9 mm |
83.4 × 9.9 mm |
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|
PLUG |
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RECEPTACLE |
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Mating Type / Direction |
Horizontal |
Vertical |
Horizontal |
Vertical |
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|
Part Number |
30030 |
30047 |
30056 |
30002 |
30007 |
|
Pin Count |
80 |
160 |
160 |
100 |
200 |
|
Dimensions (WxD) |
36.0 × 14.505 mm |
62.0 × 9.7 mm |
62.0 × 16.03 mm |
51.65 × 20.3 mm |
83.4 × 15.16 mm |
Features of the I-PEX MINIDOCK™
1. Die-cast shell and large guide pins
The robust die-cast shell structure protects the connector. Additionally, the guide pins ensure secure mating and unmating.
2. Guaranteed up to 5,000 mating cycles
(Per 1 pin)
The low insertion force contacts guarantee 5,000 mating cycles.
3. Guide pins for reliable docking
MINIDOCK™ Design

Example Mating Pair:30046-160T & 30056-160T
MINIDOCK™ features an extended guide pin design that starts alignment before contact engagement, enabling reliable self-alignment and smooth docking. This improves mating reliability and reduces the risk of contact damage caused by misaligned insertion. MINIDOCK™ offers a wide range of mating types and pin counts, including sequential contact configurations for ground, signal, and power pins. For inquiries regarding the MINIDOCK™ series, please contact us.
Features and Benefits of I-PEX Board-to-Board Solutions
- 1. Maximum Operating Frequency
- 2. ZenShield® - 360 Degrees EMI Shielding
- 3. High Density – Available Real Estate ?
- 4. Hybrid – High Speed Data and Power Signal Contacts
- 5. Flexibility – Different Profile Heights
- 6. Ruggedized Solution
- 7. Supported Industry Standards
- 8. Signal Integrity Data
- 9. Signal Integrity Testing
- 10. Custom Solutions








