I-PEX has begun development of our new LEAPWIRE™/DUALINE™ series 112 Gbps PAM4 using high-speed Twinax Cables and 112Gbps PAM4 board-to-board connection to solve these problems. These products will be used for transmission between chips inside equipment and connection to I/O connectors.
LEAPWIRE™ is the new high-speed transmission jumper solution, DUALINE™ series is the actual connector.
Click to learn more.
100 Gbps（25 Gbps x 4ch） Bi-directional, High Density, Low power, mid-board optical module
High-Speed Transmission Mid-Board Optical module
Low power consumption per Gbps
Ultra Small Optical Module
Mating Direction: Vertical
For technical documentation on this connector, click here.
100 G（25 Gbps x 4 ch） Bi-directional, Low profile, MPU integrated, Low power consumption, photoelectric conversion module
Ultra-Thin Mating Height : 2.3 mm
High-Speed Transmission: 100 Gbps (25 Gbps x 4 Channels）
MPU Integrated Active Optical Module
For technical documentation on this connector, click here.
Ideal for 5G mmWave antenna module and devices, fully-shielded and narrow design, Power supply is available with Corson Alloy contact, 0.35 mm pitch, 0.7 mm height
Ideal for high frequency applications (5G mmWave, USB4 / Thunderbolt 3, etc.)
ZenShield® fully-shielded design, decreases EMC issue caused by 5G applications
Narrow depth and low height, fully shielded board-to-board connector
Contact Pitch (mm): 0.350
Height: 0.75 Max (0.70 Nom.)
Available Pin Count: 10, 20, 30
Frequency Range: Up to 15 GHz
For technical documentation on this connector, click here.
High-speed (20+ Gbps/lane) fully-shielded with power contacts, 0.35 mm pitch, 0.7 mm height
ZenShield® fully-shielded with multi-point grounds to prevent EMI leakage
Ideal for high-speed transmission e.g. USB4 / Thunderbolt 4 (20+ Gbps / lane)
2.2 A power pin x 4 for power delivery
Contact Pitch (mm): 0.350
Height: 0.75 Max (0.70 Nom.)
Available Pin Count: 28, 34, 42, 56, 62
For technical documentation on this connector, click here.
