Ultra-Small Active Optical Module : LIGHTPASS™ Series

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Contents : 


1) LIGHTPASS™ Series Features
2) LIGHTPASS™ Series Appearance
3) LIGHTPASS™ Series Main Product Specifications
4) LIGHTPASS™ Series Evaluation Board Appearance
5) LIGHTPASS™ Series Development Roadmap

In data center equipment, it is common for outside the box, high-speed signal connectivity to be achieved using pluggable optical modules. However, with the increasing data rates, electrical losses also increase, reducing the effective distance of mid-board transmitters, requiring re-timers or the use of heavier gauge copper cable to reach the chassis port.
The LIGHTPASS™ Series makes it possible to shorten the copper trace length on the system board by placing the electrical-to-optical (E-to-O) conversion closer to the processor, reducing electrical transmission losses.

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Inter-rack Interconnects Solutions
Current Solution vs. I-PEX Next Generation Solution

 

LIGHTPASS™ Series Features


  • LIGHTPASS™-EOB 100G
    By utilizing the small and ultra-thin features of the LIGHTPASS™-EOB 100G, electrical-to-optical and optical-to-electrical conversion in a position that is close to the processor is now available and can dramatically decrease the transfer loss which used to occur in the electrical wiring between the processor and the edge of the board. 

     
  • LIGHTPASS™-EOM 100G
    While the LIGHTPASS™-EOB 100G will have a built-in microprocessor in an ultra-thin package, LIGHTPASS™-EOM 100G omits the microprocessor to minimize the footprint.
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I-PEX Next Generation Solutions for Inter-rack Interconnect

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LIGHTPASS™ Series Appearance


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LIGHTPASS™-EOB 100G
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LIGHTPASS™-EOM 100G

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LIGHTPASS™ Series Main Product Specifications


Product Name LIGHTPASS™-EOB 100G LIGHTPASS™-EOM 100G
Appearance Article-image_5_LIGHTPASS-Series.PNG

 

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Mating Type Horizontal Vertical
Mating Height 2.3 mm 8.6 mm
Built-in Microprocessor Yes No
Photoelectric Conversion of High-speed Signals

100 Gbps(25 Gbps x 4ch)

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Long-distance Transmission Long distance transmission of up to 300m using multimode fiber
Power-saving Technology

Low power consumption by Silicon-Photonics IC (Optical I/O Core)*1

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*1:Silicon-Photonics IC (Optical I/O Core) of AIO Core Co., Ltd. is installed for use in optical interconnection.

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LIGHTPASS™ Series Evaluation Board Appearance


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LIGHTPASS™ Series Development Roadmap


I-PEX continues to develop products that meet future demands for active optical modules based on Silicon-Photonics IC Optical I/O Core.

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Contact us for more information.

 

About AIO Core Co., Ltd. and ”Optical I/O Core”
AIO Core Co., Ltd. is the first incorporation-type divided company under an approval of the Ministry of Economy, Trade and Industry (METI), Japan. AIO Core has inherited the intellectual property rights along with some parts of technology from Photonics Electronics Technology Research Association (PETRA) and was newly divided from the organization.  This development was accomplished by PETRA under the trust from New Energy and Industrial Technology Development Organization (NEDO). The Optical I/O Core mass-produced by AIO Core has a feature of 5 mm square with an optical transceiver chip manufactured with “Silicon Photonics technology” which is to form optical elements on silicon substrates. Optical I/O Core has a transfer rate of 25 Gbps/ch over 4 channels, offering a total bi-directional transfer rate of 100 Gbps.