Ultra-Small Active Optical Module : LIGHTPASS® Series


AnchorContents : 

1) LIGHTPASS® Series Features
2) LIGHTPASS® Series Appearance
3) LIGHTPASS® Series Main Product Specifications
4) LIGHTPASS® Series Evaluation Board Appearance
5) LIGHTPASS® Series Development Roadmap

In data center equipment, it is common for outside the box, high-speed signal connectivity to be achieved using pluggable optical modules. However, with the increasing data rates, electrical losses also increase, reducing the effective distance of mid-board transmitters, requiring re-timers or the use of heavier gauge copper cable to reach the chassis port.
The LIGHTPASS® Series makes it possible to shorten the copper trace length on the system board by placing the electrical-to-optical (E/O) and optical-to-electrical (O/E) conversion closer to the processor, reducing electrical transmission losses.



AnchorLIGHTPASS® Series Features

    By utilizing the small and ultra-thin features of the LIGHTPASS®-EOB 100G, electrical-to-optical and optical-to-electrical conversion in a position that is close to the processor is now available and can dramatically decrease the transfer loss which used to occur in the electrical wiring between the processor and the edge of the board. 
    While the LIGHTPASS®-EOB 100G will have a built-in microprocessor in an ultra-thin package, LIGHTPASS®-EOM 100G omits the microprocessor to minimize the footprint.Article-image_2_LIGHTPASS-Series.PNG

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AnchorLIGHTPASS® Series Appearance


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AnchorLIGHTPASS® Series Main Product Specifications

Appearance Article-image_5_LIGHTPASS-Series.PNG




Mating Type Horizontal Vertical
Mating Height 2.3 mm 8.6 mm
Built-in Microprocessor Yes No
Photoelectric Conversion of High-speed Signals

100 Gbps(25 Gbps x 4ch)



Long-distance Transmission Long distance transmission of up to 300m using multimode fiber
Power-saving Technology

Low power consumption by Silicon-Photonics IC (Optical I/O Core)*1


*1:Silicon-Photonics IC (Optical I/O Core) of AIO Core Co., Ltd. is installed for use in optical interconnection.

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AnchorLIGHTPASS® Series Evaluation Board Appearance


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AnchorLIGHTPASS® Series Development Roadmap

I-PEX continues to develop products that meet future demands for active optical modules based on Silicon-Photonics IC Optical I/O Core.Article-image_10_LIGHTPASS-Series.png

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About AIO Core Co., Ltd. and ”Optical I/O Core”
AIO Core Co., Ltd. is the first incorporation-type divided company under an approval of the Ministry of Economy, Trade and Industry (METI), Japan. AIO Core has inherited the intellectual property rights along with some parts of technology from Photonics Electronics Technology Research Association (PETRA) and was newly divided from the organization.  This development was accomplished by PETRA under the trust from New Energy and Industrial Technology Development Organization (NEDO). The Optical I/O Core mass-produced by AIO Core has a feature of 5 mm square with an optical transceiver chip manufactured with “Silicon Photonics technology” which is to form optical elements on silicon substrates. Optical I/O Core has a transfer rate of 25 Gbps/ch over 4 channels, offering a total bi-directional transfer rate of 100 Gbps.

In this video LIGHTPASS®-EOB 100G (100 Gbps (25 Gbps x 4 Channels) Bi-directional, Low profile, MPU integrated, Low Power Consumption, Photoelectric Conversion Module) and LIGHTPASS®-EOM 100G (100 Gbps (25 Gbps x 4 Channels ) Bi-directional, High Density, Low Power Consumption, Mid-board Optical Module) are introduced.
I-PEX will start providing samples of the LIGHTPASS®-EOB 100G with built-in microprocessor using I-O Core's silicon photonics IC "Optical I/O Core".
I-PEX is starting to ship sample quantities of the LIGHTPASS™-EOM 100G, which uses the Silicon-Photonics IC Optical I/O Core from AIO Core Co., Ltd.
I-PEX connectors solutions for enterprise computing applications.